How many times can a BGA component be changed without affecting reliability at the same spot on the same PCB? After the initial construction, which typically involves two thermal cycles for the top and bottom side reflow thermal cycles, most businesses err on the side of caution and merely replace once at the same spot. Why BGAs are being replaced in the first place is a more general question that has to be addressed. The most common answer is a result of inadequate reflow profiling. In Lead-Free Solder, thermal cycling over time results in the following effects:
- Weak ties
- Voids in Solder
- Organic Substance
- Develop Cracking
- Crackly Joints
- “Black pad” is brought on by intermetallic layers that are fragile.
- A void is left in that location when a BGA ball pad lifts off the board.
That Said, the solder spheres are too old and have experienced too many thermal cycles, which causes all these problems. This is because there is insufficient heat dispersion.
Since laws about consumer electronics and the use of Leaded solder were put in place, the effects of thermal cycling on BGA packages have intensified. This meant that only lead-free solder, which is far more brittle and susceptible to temperature cycling, could be used in consumer electronics.
Therefore, replacing the solder is the best course of action. In addition, we constructed a heat sink modification to reduce the GPU’s operating heat by 30% to lessen the damage each thermal cycle produces.
The job must go to qualified specialists well-versed in the BGA replacement procedures. BGA replacement service takes expert-level attention, so it’s critical to have staff who manage these operations utilizing cutting-edge diagnostic tools and top-notch software.
They must be aware enough to assess the level of damage done to the circuit board and be skillful enough to identify its failure’s main cause. As a result, the technicians can better replace and fix defective boards with solder joints or other parts.
This will demonstrate how to replace a BGA using the least expensive tools in the simplest manner possible. The following is necessary for this method:
- New gadget to be installed (or previously reballed device)
- StencilQuik(TM) stay-in-place stencil that matches the BGA’s pattern
- Adhesive paste
- Little squeegee
- Source for reflow
- Magnification apparatus for examination
While an x-ray is not on this list, this procedure does not require a high-end rework system, even though it should be.
Step 1: Prepare the Area:
Isopropyl alcohol or another approved cleaner should be used to clean the region with a low lint, low charge-generating wipe.
Step 2: Position the Stencil on the BGA and Align It:
Start in a corner and gradually align and position the rework stencil so that the apertures line up with the pads on the BGA board after removing the stencil’s backing.
Step 3: Press firmly to activate the adhesive:
Apply pressure to the stencil’s surface to get the glue on work.Â
Step 4: Squeegee solder paste into the apertures:
Solder paste should be squeezed into the apertures using a micro squeegee slightly larger than the device. Select the proper solder alloy.
Move the squeegee back and forth until all of the apertures are clean. Wipe the surface and any leftover solder paste from the stencil with a static- and lint-free cloth.
 Step 5: Put the replacement device in the stencil apertures:
Put the gadget inside the stencil’s openings. The solder balls fit into the stencil perforations with a discreet “feeling.”
Avoid pressing downward to prevent “squeezing out” the solder paste.
Using the reference designator, confirm that the part is oriented correctly.
Step 6: Reflow and inspection:
Follow the solder alloy profile using a low-end reflow source.
Lower-end systems may be this heart’s source. Please verify that the solder balls have collapsed consistently by looking at them. The BGA stencil also serves as a “band-aid” for any harmed mask material.Â
As the boards are now constructed with very fine pitch components, each BGA replacement project has unique issues. To ensure that the duties are completed in accordance with IPC standards, it is advised to collaborate with an expert.
With the capacity to install BGAs with a minimum 0.4 mm pitch on PCB boards, a number of PCB design and manufacturing companies provide BGA assembly, repair, and replacement services.
You can contact the top BGA replacement service providers, who offer BGA assembly and repair services with the guarantee of the best possible craftsmanship. These businesses are at the forefront of handling most of the BGA package sizes and ball counts used today, and they help return all damaged BGAs to their pre-damage requirements.
